• June 16, 2019

Teardown and Market Analysis of Sony's 3D Time-of-Flight Depth Sensing Camera Module, 2019 Report - ResearchAndMarkets.com - Odessa American: Business

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Teardown and Market Analysis of Sony's 3D Time-of-Flight Depth Sensing Camera Module, 2019 Report - ResearchAndMarkets.com

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Posted: Wednesday, June 12, 2019 6:29 am | Updated: 7:03 am, Wed Jun 12, 2019.

DUBLIN--(BUSINESS WIRE)--Jun 12, 2019--

The "Sony's 3D Time-of-Flight Depth Sensing Camera Module" report has been added to ResearchAndMarkets.com's offering.

Following its first introduction of a 3D structured light camera on the front of the Find X, last year, Oppo is now pioneering the use of 3D Time-of-Flight (ToF) in its Rx17 Pro. Lenovo did a similar integration on the rear of one of its products a few years ago, integrating a pmd/Infineon solution in a high-end phone. In doing this, Asus and Lenovo added an additional Near Infra-Red (NIR) Global Shutter (GS) camera, but Oppo doesn't have such a dedicated NIR GS Camera. Instead, Oppo uses the latest generation of ToF camera technology from Sony Depthsensing Solutions, formerly known as SoftKinetic.

The rear optical hub is packaged in one metal enclosure and features several cameras and a flood illuminator. The complete system features a telephoto and wide-angle camera module and a 3D ToF camera. The distinguishing characteristic of the 3D depth sensing camera is the addition of a NIR flood illuminator.

This report focuses its analysis on the 3D depth sensing system. All components are standard and can be found on the market. That includes a BackSide Illumination (BSI) ToF image sensor featuring 10 m x 10 m size pixels and resolution of 46 kilopixel, developed by Sony Depthsensing Solutions. It also has one vertical cavity surface emitting laser (VCSEL) for the flood illuminator, coming from a major supplier. This is the first ToF imager found on the market featuring BSI technology, which is commonly used by Sony, coupled with Current Assisted Photonic Demo-dulation (CPAD) developed by Sony Depthsensing Solutions.

Along with the complete 3D depth sensing system, this report analyses the systems cost and estimates its price. It also includes a physical and technical comparison with another 3D sensing system from Lenovo in the Phab2Pro, using the first generation pmd/Infineon ToF Imager. The comparison looks at system integration, the NIR camera module and the flood illuminator architecture.

Key Topics Covered:

1. Overview/Introduction

  • Sony Company Profile
  • Oppo RX17 Pro - Teardown and Market Analysis

2. Physical Analysis

  • Physical Analysis Methodology
  • 3D Sensing System Disassembly and Cross-Section
  • NIR Camera ToF Sensor
    • View, dimensions, and cross-section
  • NIR Camera ToF Sensor Die
    • View, dimensions, pixels, delayering and main block IDs
    • Process and cross-section
  • Flood Illuminator Module Disassembly and Cross-Section
  • NIR VCSEL Dies
    • View, and dimensions
    • Dies process and cross-section
  • Physical Data Summary

3. Physical Comparison: Lenovo Phab2Pro

  • System Integration
  • NIR Camera Module and ToF Sensor
  • Flood Illuminator and VCSEL

4. Manufacturing Process

  • Die Fabrication Unit : NIR Image Sensor, NIR VCSEL,
  • NIR Image Sensor and VCSEL Process Flow

5. Cost Analysis

  • Cost Analysis Overview
  • Supply Chain Description and Yield Hypotheses
  • NIR Image Camera Module Cost
    • Front-end (FE), microlens, BSI and total FE cost
    • Wafer and die cost
    • Lens module and assembly cost
  • NIR Flood Illuminator Cost
    • Front-End (FE) cost
    • FE cost per process step
    • Wafer and die cost
    • Assembly cost

6. Estimated Price Analysis: NIR Camera Module, Flood Illuminator Module, and Optical Hub

Companies Mentioned

  • Asus
  • Lenovo
  • SoftKinetic
  • Sony
  • Sony Depthsensing Solutions

For more information about this report visit https://www.researchandmarkets.com/r/mgvfwy

View source version on businesswire.com:https://www.businesswire.com/news/home/20190612005455/en/

CONTACT: ResearchAndMarkets.com

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Related Topics:Cameras and Camera Equipment,Tablet and Mobile Device Hardware,Optical Sensors

KEYWORD:

INDUSTRY KEYWORD: TECHNOLOGY PHOTOGRAPHY MOBILE/WIRELESS

SOURCE: Research and Markets

Copyright Business Wire 2019.

PUB: 06/12/2019 07:29 AM/DISC: 06/12/2019 07:29 AM

http://www.businesswire.com/news/home/20190612005455/en

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